Trench gate trench field plate vertical MOSFET

ABSTRACT

A semiconductor device having a vertical drain extended MOS transistor may be formed by forming deep trench structures to define vertical drift regions of the transistor, so that each vertical drift region is bounded on at least two opposite sides by the deep trench structures. The deep trench structures are spaced so as to form RESURF regions for the drift region. Trench gates are formed in trenches in the substrate over the vertical drift regions. The body regions are located in the substrate over the vertical drift regions.

FIELD OF THE INVENTION

This invention relates to the field of semiconductor devices. Moreparticularly, this invention relates to drain extended transistors insemiconductor devices.

BACKGROUND OF THE INVENTION

An extended drain metal oxide semiconductor (MOS) transistor may becharacterized by the resistance of the transistor in the on state, thelateral area which the transistor occupies at the top surface of thesubstrate containing the transistor, and the breakdown potential betweenthe drain node and the source node of the transistor which limits themaximum operating potential of the transistor. It may be desirable toreduce the area of the transistor for given values of the on-stateresistance and the breakdown potential. One technique to reduce the areais to configure the drift region in the extended drain in a verticalorientation, so that drain current in the drift region flowsperpendicularly to the top surface of the substrate. Integrating avertically oriented drift region in a semiconductor device using planarprocessing while maintaining desired fabrication cost and complexity maybe problematic.

SUMMARY OF THE INVENTION

The following presents a simplified summary in order to provide a basicunderstanding of one or more aspects of the invention. This summary isnot an extensive overview of the invention, and is neither intended toidentify key or critical elements of the invention, nor to delineate thescope thereof. Rather, the primary purpose of the summary is to presentsome concepts of the invention in a simplified form as a prelude to amore detailed description that is presented later.

A semiconductor device having a vertical drain extended MOS transistormay be formed by forming deep trench structures to define at least onevertical drift region of the transistor. The vertical drift regions arebounded on at least two opposite sides by said deep trench structures.The deep trench structures are spaced so as to form RESURF regions forthe drift region. Trench gates are formed in trenches in the substrateover the vertical drift regions. An optional buried drain contact layermay connect to the vertical drift regions to provide drain connections,or vertical drain contact regions which are adjacent to the verticaldrift regions may provide drain connections.

DESCRIPTION OF THE VIEWS OF THE DRAWING

FIG. 1 is a cross section of a semiconductor device having a verticaldrain extended MOS transistor.

FIG. 2A through FIG. 2H are cross sections of the semiconductor deviceof FIG. 1, depicted in successive stages of fabrication.

FIG. 3 is a cross section of a semiconductor device having a verticaldrain extended MOS transistor.

FIG. 4 is a cross section of a semiconductor device having a verticaldrain extended MOS transistor.

FIG. 5 is a cross section of a semiconductor device having a verticaldrain extended MOS transistor.

FIG. 6 is a cross section of a semiconductor device having a verticaldrain extended MOS transistor.

FIG. 7 is a cross section of a semiconductor device having a verticaldrain extended MOS transistor.

FIG. 8 and FIG. 9 are cross sections of different configurations oftrench gates disposed in trenches.

FIG. 10 through FIG. 12 are top views of semiconductor devices havingvertical drain extended MOS transistors.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

The following co-pending patent applications contain related matter andare incorporated by reference: U.S. patent application Ser. No.14/044,909 entitled “TRENCH GATE TRENCH FIELD PLATE SEMI-VERTICALSEMI-LATERAL MOSFET;” and U.S. patent application Ser. No. 14/044,926entitled “VERTICAL TRENCH MOSFET DEVICE IN INTEGRATED POWERTECHNOLOGIES.”

The present invention is described with reference to the attachedfigures. The figures are not drawn to scale and they are provided merelyto illustrate the invention. Several aspects of the invention aredescribed below with reference to example applications for illustration.It should be understood that numerous specific details, relationships,and methods are set forth to provide an understanding of the invention.One skilled in the relevant art, however, will readily recognize thatthe invention can be practiced without one or more of the specificdetails or with other methods. In other instances, well-known structuresor operations are not shown in detail to avoid obscuring the invention.The present invention is not limited by the illustrated ordering of actsor events, as some acts may occur in different orders and/orconcurrently with other acts or events. Furthermore, not all illustratedacts or events are required to implement a methodology in accordancewith the present invention.

A semiconductor device having a vertical drain extended MOS transistormay be formed by forming deep trench structures to define at least onevertical drift region of the transistor. The vertical drift regions arebounded on at least two opposite sides by said deep trench structures.The deep trench structures are spaced so as to form RESURF regions forthe drift region. Trench gates are formed in trenches in the substrateover the vertical drift regions. An optional buried drain contact layermay connect to the vertical drift regions to provide drain connections,or vertical drain contact regions which are adjacent to the verticaldrift regions may provide drain connections. The semiconductor devicemay be, in one example, an integrated circuit containing the verticaldrain extended MOS transistor and other transistors. The semiconductordevice may be, in another example, a discrete device in which thevertical drain extended MOS transistor is the only transistor. Avertical drain contact region may possibly be disposed between adjacentportions of the deep trench structures.

For the purposes of this description, the term “RESURF” will beunderstood to refer to a material which reduces an electric field in anadjacent semiconductor region. A RESURF region may be for example asemiconductor region with an opposite conductivity type from theadjacent semiconductor region. RESURF structures are described inAppels, et al., “Thin Layer High Voltage Devices” Philips J, Res. 351-13, 1980.

The examples described in this disclosure describe n-channel devices. Itwill be recognized that corresponding p-channel devices may be formed byappropriate changes in doping polarities. FIG. 1 is a cross section of asemiconductor device having a vertical drain extended MOS transistor.The semiconductor device 100 is formed in and on a p-type semiconductorsubstrate 102. The vertical drain extended MOS transistor 110 includes aplurality of deep trench structures 104 disposed in the substrate 102 soas to define at least one n-type vertical drain contact region 106 and aplurality of adjacent n-type vertically oriented drift regions 108separated by instances of the deep trench structures 104. The at leastone vertical drain contact region 106 and the vertically oriented driftregions 108 contact an n-type buried layer 112 disposed in the substrate102. The deep trench structures 104 are all substantially equal indepth.

Trench gates 114 and corresponding gate dielectric layers 116 aredisposed in trenches in the vertically oriented drift regions 108, sothat top portions of the vertically oriented drift regions 108 contactbottom portions of the gate dielectric layers 116. The trench gates 114may extend across the vertically oriented drift regions 108 and abut thedeep trench structures 104 on opposite sides of the vertically orienteddrift regions 108, as shown in FIG. 1. At least one p-type body region118 is disposed in the substrate 102 over the vertically oriented driftregions 108 and contacting the gate dielectric layers 116. N-type sourceregions 120 are disposed in the substrate 102 contacting the at leastone p-type body region 118 and the gate dielectric layers 116. Optionalp-type body contact regions 122 may be disposed in the substrate 102contacting the at least one p-type body region 118. Top surfaces of thetrench gates 114 are substantially even with a top surface of thesubstrate 102; this may be accomplished, for example, using a chemicalmechanical polish (CMP) process. It will be recognized that otherconfigurations of trench gates may be used in the vertical drainextended MOS transistor 110 with the configuration of deep trenchstructures 104, vertical drain contact regions 106 and verticallyoriented drift regions 108 depicted in FIG. 1.

The deep trench structures 104 are 1 to 5 microns deep, and 0.5 to 1.5microns wide. For example, deep trench structures 104 which are 2.5microns deep may provide 30 volt operation for the vertical drainextended MOS transistor 110. Deep trench structures 104 which are 4microns deep may provide 50 volt operation for the vertical drainextended MOS transistor 110. The deep trench structures 104 havedielectric liners 124 and may have optional electrically conductivecentral members 126. Instances of the deep trench structures 104abutting the vertically oriented drift regions 108 are spaced 0.5 to 2microns apart so as to provide RESURF regions for the verticallyoriented drift regions 108. Instances of the deep trench structures 104abutting the vertical drain contact region 106 may be spaced, forexample, 0.5 to 2.5 microns apart. During operation of the verticaldrain extended MOS transistor 110, the electrically conductive centralmembers 126, if present, may be electrically biased to reduce a peakelectric field in the vertically oriented drift regions 108. Forexample, the electrically conductive central members 126 may beconnected to source regions 120, to the trench gates 114 or to a biassource having a desired potential.

FIG. 2A through FIG. 2H are cross sections of the semiconductor deviceof FIG. 1, depicted in successive stages of fabrication. Referring toFIG. 2A, an n-type buried layer implanted region 128 is formed in thesubstrate 102 in an area defined for the n-type buried layer 112 of FIG.1, for example by implanting antimony at a dose of 1×10¹⁵ cm⁻² to 5×10¹⁵cm⁻² at 30 keV to 100 keV using an implant mask.

Referring to FIG. 2B, a thermal drive operation and a p-type epitaxialgrowth operation are performed which diffuses and activates theimplanted n-type dopants in the buried layer implanted region 128 toform the n-type buried layer 112 and form a p-type epitaxial layer 130of the substrate 102 over the n-type buried layer 112. The epitaxiallayer 130 may be, for example, 3 to 6 microns thick.

Referring to FIG. 2C, the deep trench structures 104 are formed byetching deep isolation trenches in the substrate, forming the dielectricliners 124 and subsequently optionally forming the electricallyconductive central members 126. The deep isolation trenches may beformed, for example, by a process stating with forming a layer of hardmask material over the top surface of the substrate 102. A hard mask maybe formed by forming an etch mask by a photolithographic followed byremoving the hard mask material over regions defined for the deepisolation trenches using a reactive ion etch (RIE) process. Afterpatterning the hard mask, material is removed from the substrate 102 inthe deep isolation trenches using an anisotropic etch process, such as aBosch deep RIE process or a continuous deep RIE process.

The dielectric liners 124 may include, for example, thermally grownsilicon dioxide. The dielectric liners 124 may also include one or morelayers of dielectric material such as silicon dioxide, silicon nitrideand/or silicon oxynitride, formed by a chemical vapor deposition (CVD)process. The electrically conductive central members 126, if included inthe vertical drain extended MOS transistor 110, are formed on thedielectric liners 124. The electrically conductive central members 126may include, for example, polycrystalline silicon, commonly referred toas polysilicon, formed by thermally decomposing SiH4 gas inside alow-pressure reactor at a temperature of 580° C. to 650° C. Thepolysilicon may be doped during formation to provide a desiredelectrical resistance. The filled deep isolation trenches form the deeptrench structures 104. Unwanted dielectric material over the top surfaceof the substrate 102 from formation of the dielectric liners 124 andunwanted conductive material over the top surface of the substrate 102from formation of the electrically conductive central members 126 may beremoved, for example using an etchback and/or chemical mechanical polish(CMP) process.

Referring to FIG. 2D, a drain contact ion implant process is performedwhich implants n-type dopants such as phosphorus into the substrate 102in an area defined for the vertical drain contact region 106 of FIG. 1,to form a drain contact implanted region 132. A dose of the draincontact ion implant process may be, for example, 1×10¹⁶ cm⁻² to 3×10¹⁶cm⁻².

Referring to FIG. 2E, a drift region ion implant process is performedwhich implants n-type dopants such as phosphorus into the substrate 102in and over an area defined for the vertically oriented drift regions108 of FIG. 1, to form drift implanted regions 134. A dose of the driftregion ion implant process may be, for example, 1×10¹² cm⁻² to 1×10¹³cm⁻². In one version of the instant embodiment, the drift implantedregions 134 may be confined to an area of the substrate betweeninstances of the deep trench structures 104 abutting the verticallyoriented drift regions 108, as depicted in FIG. 2E, by forming a driftregion implant mask which blocks the substrate 102 outside the areadefined for the deep trench structures 104. In an alternate version, thedrift implanted regions 134 may extend into area of the substratedefined for the vertical drain contact region 106 of FIG. 1, possibly byperforming the drift region ion implant process as a blanket implantprocess. A dose of the drain contact ion implant process is at least tentimes higher than the drift region ion implant dose.

Referring to FIG. 2F, a thermal drive operation is performed which heatsthe substrate 102 so as to activate and diffuse the implanted dopants inthe drift implanted regions 134 and the drain contact implanted region132 and thereby form the vertically oriented drift regions 108 and thevertical drain contact region 106, respectively. Conditions of thethermal drive operation depend on a depth of the deep trench structures104 and a desired lateral extent of the vertical drain contact region106 at the bottoms of the deep trench structures 104. For example, avertical drain extended MOS transistor 110 with deep trench structures104 that are 2.5 microns deep may have a thermal drive operation whichheats the substrate 102 at 1100° C. for 3.5 to 4 hours, or equivalentanneal conditions, for example, 1125° C. for 2 hours, or 1050° C. for 12hours.

Referring to FIG. 2G, the at least one p-type body region 118 is formedover the vertically oriented drift regions 108. The body region 118 maybe formed, for example, by forming a photoresist implant mask over thetop surface of the substrate 102 and implanting p-type dopants such asboron into the vertically oriented drift regions 108, at a dose of1×10¹³ cm⁻² to 5×10¹³ cm⁻². The implanted p-type dopants maysubsequently be activated by an anneal process, for example 1000° C. for60 seconds in a rapid thermal processor (RTP) tool, or equivalent annealconditions, such as 1025° C. for 30 seconds, or 975° C. for 100 seconds.Alternatively, a blanket body implant may be performed which implantsp-type body dopants into the substrate 102, including the verticallyoriented drift regions 108 and the deep trench structures 104.

Referring to FIG. 2H, the trench gates 114 and gate dielectric layers116 are formed in gate trenches in the substrate 102 over the verticallyoriented drift regions 108 so that the gate dielectric layers 116 abutthe body region 118. The gate trenches may be formed by forming a hardmask layer over the substrate 102 and patterning the hardmask layerusing a photoresist etch mask and etching the hard mask layer to form agate trench hard mask. The gate trenches may then be etched using atimed RIE process. A subsequent wet clean operation such as a dilutehydrofluoric acid clean may remove unwanted residue from the gatetrenches produced by the RIE process.

The gate dielectric layers 116 are formed on sides and bottoms of thegate trenches. The gate dielectric layers 116 may be one or more layersof silicon dioxide, silicon oxy-nitride, aluminum oxide, aluminumoxy-nitride, hafnium oxide, hafnium silicate, hafnium siliconoxy-nitride, zirconium oxide, zirconium silicate, zirconium siliconoxy-nitride, a combination of the aforementioned materials, or otherinsulating material. The gate dielectric layers 116 may include nitrogenas a result of exposure to a nitrogen-containing plasma or anitrogen-containing ambient gas at temperatures of 50 C to 800 C. Thegate dielectric layers 116 may be formed by any of a variety of gatedielectric formation processes, for example thermal oxidation, plasmanitridation of an oxide layer, and/or dielectric material deposition byatomic layer deposition (ALD). A thickness of the gate dielectric layers116 may be 2.5 to 3.3 nanometers per volt of gate-source bias on thevertical drain extended MOS transistor 110. For example, an instance ofthe vertical drain extended MOS transistor 110 operating with 30 voltson the trench gates 114 relative to the source regions 120 may have thegate dielectric layers 116 with a thickness of 75 to 100 nanometers.

Subsequently, the trench gates 114 are formed on the gate dielectriclayers 116, for example by forming a layer of polysilicon conformably inthe gate trenches on the gate dielectric layers 116 and over thesubstrate 102, followed by removing unwanted polysilicon from areasoutside the gate trenches. Other gate materials may be used, includingfully silicided polysilicon, replacement metal such as titanium nitride.In an alternate version of the instant example, the body region 118 maybe formed after etching the gate trenches and forming the trench gates114.

FIG. 3 is a cross section of a semiconductor device having a verticaldrain extended MOS transistor. The semiconductor device 300 may beformed in and on a p-type semiconductor substrate 302 as described inreference to FIG. 2A. An n-type buried layer 312 is formed in thesubstrate 302, possibly as described in reference to FIG. 2A and FIG.2B. Alternatively, the n-type buried layer 312 may be formed by ablanket n-type epitaxial process followed by a p-type epitaxial processto produce the n-type buried layer everywhere in the semiconductordevice 300. In a further version of the instant example, the substrate302 may be an n-type wafer with a p-type epitaxial layer formed on a topsurface of the n-type wafer.

A plurality of deep trench structures 304 are subsequently formed, forexample as described in reference to FIG. 2C. A plurality of adjacentn-type vertically oriented drift regions 308 are subsequently formed,separated by instances of the deep trench structures 304 as described inreference to FIG. 1. Trench gates 314 and corresponding gate dielectriclayers 316 are formed in trenches in the vertically oriented driftregions 308, so that top portions of the vertically oriented driftregions 308 contact bottom portions of the gate dielectric layers 316.At least one p-type body region 318 is disposed in the substrate 302over the vertically oriented drift regions 308 and contacting the gatedielectric layers 316. N-type source regions 320 are disposed in thesubstrate 302 contacting the at least one p-type body region 318 and thegate dielectric layers 316. Optional p-type body contact regions 322 maybe disposed in the substrate 302 contacting the at least one p-type bodyregion 318.

In one version of the instant example, material may be removed from abottom portion of the substrate 302 to provide a thinned substrate asdepicted in FIG. 3, for example 50 to 250 microns thick, in which then-type buried layer 312 extends to a bottom surface of the thinnedsubstrate 302. In another version, the substrate 302 may remainsubstantially at a starting thickness.

A drain contact metal layer 336 is formed on a bottom surface of thesubstrate 302. The thus formed vertical drain extended MOS transistor310 has a vertical configuration, in which drain connection is made at abottom of the transistor 310 and source connection is made at a top ofthe transistor 310, advantageously providing higher drain currentcapacity than a topside drain connection configuration.

FIG. 4 is a cross section of a semiconductor device having a verticaldrain extended MOS transistor. The semiconductor device 400 is formed inand on a p-type semiconductor substrate 402 as described in reference toFIG. 2A. Deep trench structures 404 are disposed in the substrate 402 asdescribed in reference to FIG. 2A and FIG. 2B, so as to define aplurality of vertical drain contact regions 406 and a plurality ofvertically oriented drift regions 408 of the vertical drain extended MOStransistor 410. The vertical drain contact regions 406 are bounded on atleast two opposite sides by the deep trench structures 404. Eachvertically oriented drift region 408 is adjacent to at least one deeptrench structure 404, as depicted in FIG. 4. In another version of theinstant example, every vertically oriented drift region 408 may beadjacent to two instances of the deep trench structures 404. Thevertical drain contact regions 406 extend below the deep trenchstructures 404 and makes contact to the adjacent vertically orienteddrift regions 408. In the instant example, the vertical drain extendedMOS transistor 410 is free of an n-type buried layer which extends underthe vertically oriented drift regions 408, which may advantageouslysimplify fabrication of the semiconductor device 400.

Trench gates 414 and corresponding gate dielectric layers 416 aredisposed in trenches in the vertically oriented drift regions 408, sothat top portions of the vertically oriented drift regions 408 contactbottom portions of the gate dielectric layers 416. The trench gates 414may be confined to a central portion of the vertically oriented driftregions 408 as shown in FIG. 4. At least one p-type body region 418 isdisposed in the substrate 402 over the vertically oriented drift regions408 and contacting the gate dielectric layers 416. N-type source regions420 are disposed in the substrate 402 contacting the at least one p-typebody region 418 and the gate dielectric layers 416. Optional p-type bodycontact regions 422 may be disposed in the substrate 402 contacting theat least one p-type body region 418. It will be recognized that otherconfigurations of trench gates may be used in the vertical drainextended MOS transistor 410 of FIG. 4

FIG. 5 is a cross section of a semiconductor device having a verticaldrain extended MOS transistor. The semiconductor device 500 is formed inand on a p-type semiconductor substrate 502 as described in reference toFIG. 2A. Deep trench structures 504 are disposed in the substrate 502 asdescribed in reference to FIG. 2A and FIG. 2B, so as to define at leastone vertical drain contact region 506 and at least one verticallyoriented drift regions 508 of the vertical drain extended MOS transistor510. The vertical drain contact region 506 is bounded on at least twoopposite sides by the deep trench structures 504. Optionally, an n-typeburied layer may be disposed in the substrate 502, extending under thevertically oriented drift regions 508.

Trench gates 514 and corresponding gate dielectric layers 516 aredisposed in trenches in the vertically oriented drift regions 508. Thetrench gates 514 may be confined to a central portion of the verticallyoriented drift regions 508 as shown in FIG. 5. At least one p-type bodyregion 518 is disposed in the substrate 502 over the vertically orienteddrift regions 508 and contacting the gate dielectric layers 516. N-typesource regions 520 are disposed in the substrate 502 contacting the atleast one p-type body region 518 and the gate dielectric layers 516.Optional p-type body contact regions 522 may be disposed in thesubstrate 502 contacting the at least one p-type body region 518.

In the instant example, the vertically oriented drift regions 508 arebelow the gate dielectric layers 516 and do not directly contact thegate dielectric layers 516. N-type drift region links 538 are disposedunder, and contacts, the gate dielectric layers 516 and extends down to,and contacts, the vertically oriented drift regions 508. Duringoperation of the vertical drain extended MOS transistor 510, the driftregion links 538 provide a portion of an electrical connections betweenthe vertical drain contact regions 506 and channels in the body region518. The drift region links 538 may be formed, for example, by ionimplanting n-type dopants into the substrate 502 after the gate trenchesare etched and before gate material is formed in the gate trenches. Theconfiguration of FIG. 5 may advantageously provide more repeatable gatelengths of the vertical drain extended MOS transistor 510 duringproduction fabrication, because the gate lengths are determined bydepths of the gate trenches and depths of the source regions 520.Variations in depths of the body region 518 thus do not causesignificant variations in the gate lengths. It will be recognized thatother configurations of trench gates may be used in the vertical drainextended MOS transistor 510 of FIG. 5.

FIG. 6 is a cross section of a semiconductor device having a verticaldrain extended MOS transistor. The semiconductor device 600 is formed inand on a p-type semiconductor substrate 602 as described in reference toFIG. 2A. Deep trench structures 604 are disposed in the substrate 602 asdescribed in reference to FIG. 2A and FIG. 2B, so as to define at leastone vertical drain contact region 606 and at least one verticallyoriented drift regions 608 of the vertical drain extended MOS transistor610. The vertical drain contact regions 606 are bounded on at least twoopposite sides by the deep trench structures 604. The vertical draincontact regions 606 extend below the deep trench structures 604.Optionally, an n-type buried layer 612 may be disposed in the substrate602, extending under the vertically oriented drift regions 608; thevertical drain contact regions 606 contact the n-type buried layer 612to provide a drain connection to the vertically oriented drift regions608. Alternatively, each vertically oriented drift region 608 maypossibly be adjacent to at least one deep trench structure 604, asdescribed in reference to FIG. 4, obviating the need for the n-typeburied layer 612.

Long trench gates 614 and corresponding gate dielectric layers 616 aredisposed in long trenches in the vertically oriented drift regions 608,so that top portions of the vertically oriented drift regions 608contact bottom portions of the gate dielectric layers 616. The longtrench gates 614 are confined to a central portion of the verticallyoriented drift regions 608 as shown in FIG. 6. At least one p-type bodyregion 618 is disposed in the substrate 602 over the vertically orienteddrift regions 608 and contacting the gate dielectric layers 616. N-typesource regions 620 are disposed in the substrate 602 contacting the atleast one p-type body region 618 and the gate dielectric layers 616.Long trench gates 614 may advantageously provide a desired value ofspecific resistivity, that is a product of on-state resistance andtransistor area, for the vertical drain extended MOS transistor 610.

FIG. 7 is a cross section of a semiconductor device having a verticaldrain extended MOS transistor. The semiconductor device 700 is formed inand on a p-type semiconductor substrate 702 as described in reference toFIG. 2A. Deep trench structures 704 are disposed in the substrate 702 asdescribed in reference to FIG. 2A and FIG. 2B, so as to define at leastone vertical drain contact region 706 and at least one verticallyoriented drift regions 708 of the vertical drain extended MOS transistor710. The vertical drain contact regions 706 are bounded on at least twoopposite sides by the deep trench structures 704. The vertical draincontact regions 706 extend below the deep trench structures 704.Optionally, an n-type buried layer 712 may be disposed in the substrate702, extending under the vertically oriented drift regions 708; thevertical drain contact regions 706 contact the n-type buried layer 712to provide a drain connection to the vertically oriented drift regions708. Alternatively, each vertically oriented drift region 708 maypossibly be adjacent to at least one deep trench structure 704, asdescribed in reference to FIG. 4, obviating the need for the n-typeburied layer 712.

Trench gates 714 and corresponding gate dielectric layers 716 aredisposed in trenches in the vertically oriented drift regions 708, sothat top portions of the vertically oriented drift regions 708 contactbottom portions of the gate dielectric layers 716. The trench gates 714extend partway across the vertically oriented drift regions 708 and abutthe deep trench structures 704 on exactly one side of the verticallyoriented drift regions 708. At least one p-type body region 718 isdisposed in the substrate 702 over the vertically oriented drift regions708 and contacting the gate dielectric layers 716. N-type source regions720 are disposed in the substrate 702 contacting the at least one p-typebody region 718 and the gate dielectric layers 716. Optional p-type bodycontact regions 722 may be disposed in the substrate 702 contacting theat least one p-type body region 718. The trench gates 714 may be shorttrench gates as depicted in FIG. 7, or may be long trench gates similarto the long trench gates described in reference to FIG. 6. Forming thetrench gates to abut the deep trench structures 704 on exactly one sideof the vertically oriented drift regions 708 may provide a desiredbalance between operating voltage and specific resistivity for thevertical drain extended MOS transistor 710.

FIG. 8 and FIG. 9 are cross sections of different configurations oftrench gates disposed in trenches. Referring to FIG. 8, a trench gate814 and gate dielectric layer 816 are formed in a gate trench in asubstrate 802 The gate dielectric layer 816 and the trench gate 814overlap a top surface of the substrate 802, for example by at least 500nanometers, which may simplify fabrication of the trench gate 814. Thetrench gate 814 may be formed by an RIE process using aphotolithograpically defined etch mask. The gate dielectric layer 816and the trench gate 814 may be formed concurrently with a transistorgate dielectric layer 840 and a transistor gate 842 of a planar MOStransistor 844.

Referring to FIG. 9, a trench gate 914 and gate dielectric layer 916 areformed in a gate trench in a substrate 902. The trench gate 914 extendsabove, but does not overlap, a top surface of the substrate 902. Thismay be accomplished by patterning the trench gate 914 with an RIEprocess using a photolithograpically defined etch mask, followed by anisotropic etchback process. The trench gate 914 configuration mayadvantageously reduce unwanted capacitance between the trench gate 914and the substrate 902 without requiring a CMP process. The gatedielectric layer 916 and the trench gate 914 may be formed concurrentlywith a transistor gate dielectric layer 940 and a transistor gate 942 ofa planar MOS transistor 944.

FIG. 10 through FIG. 12 are top views of semiconductor devices havingvertical drain extended MOS transistors. Trench gates depicted in FIG.10 through FIG. 12 are confined to a central portion of the verticallyoriented drift regions as discussed in reference to FIG. 4, but it willbe recognized that other configurations of gates may be used in theexamples depicted. Referring to FIG. 10, the semiconductor device 1000is formed in and on a semiconductor substrate 1002 as described inreference to FIG. 2A. A deep trench structure 1004 encloses a pluralityof adjacent vertical drift regions 1008. Each vertical drift region 1008includes at least one gate 1014 and gate dielectric layer 1016. Avertical drain contact region 1006 surrounds the plurality of adjacentvertical drift regions 1008. The vertical drift regions 1008 and thesurrounding vertical drain contact region 1006 are n-type; an n-typeregion extends under the plurality of adjacent vertical drift regions1008 to provide an electrical connection to the surrounding verticaldrain contact region 1006. Another instance of the deep trenchstructures 1004 laterally surrounds the vertical drain extended MOStransistor 1010. Electrical connection to the vertical drain contactregion 1006 is made at a top surface of the substrate 1002. Configuringthe vertical drift regions 1008 adjacent to each other mayadvantageously reduce an area required for the vertical drain extendedMOS transistor 1010, thereby reducing a fabrication cost of thesemiconductor device 1000.

Referring to FIG. 11, the semiconductor device 1100 is formed in and ona semiconductor substrate 1102 as described in reference to FIG. 2A. Aplurality of deep trench structures 1104 with linear configurations isdisposed in the substrate, with vertical drift regions 1108 disposedbetween adjacent pairs of the linear deep trench structures 1104, sothat each adjacent pair of vertical drift regions 1108 is separated byexactly one deep trench structure 1104. Each vertical drift region 1108includes at least one gate 1114 and gate dielectric layer 1116.Instances of vertical drain contact regions 1106 with linearconfigurations surround the vertical drift regions 1108; each verticaldrain contact region 1106 is separated from the vertical drift regions1108 by a linear deep trench structure 1104. The vertical drift regions1108 and the surrounding vertical drain contact regions 1106 are n-type;an n-type region extends under the plurality of vertical drift regions1108 to provide an electrical connection to the surrounding verticaldrain contact regions 1106. Another instance of the deep trenchstructures 1104 laterally surrounds the vertical drain extended MOStransistor 1110. Electrical connection to the vertical drain contactregions 1106 are made at a top surface of the substrate 1102.Configuring the vertical drift regions 1108 adjacent to each other mayadvantageously reduce an area required for the vertical drain extendedMOS transistor 1110, thereby reducing a fabrication cost of thesemiconductor device 1100. Configuring all the deep trench structures1104 to be free of T-shaped branches may desirably simplify afabrication sequence of the semiconductor device 1100, therebyadvantageously further reducing the fabrication cost.

Referring to FIG. 12, the semiconductor device 1200 is formed in and ona semiconductor substrate 1202 as described in reference to FIG. 2A. Aplurality of deep trench structures 1204 with linear configurations isdisposed in the substrate, with vertical drift regions 1208 disposedbetween adjacent pairs of the linear deep trench structures 1204, sothat each adjacent pair of vertical drift regions 1208 is separated byexactly one deep trench structure 1204. Each vertical drift region 1208includes at least one gate 1214 and gate dielectric layer 1216.Instances of vertical drain contact regions 1206 with linearconfigurations parallel to the vertical drift regions 1208 are disposedproximate to a first instance and a last instance of the vertical driftregions 1208. Both vertical drain contact regions 1206 are disposedbetween two parallel linear instances of the deep trench structures1204. The vertical drift regions 1208 and the surrounding vertical draincontact regions 1206 are n-type; an n-type region extends under theplurality of vertical drift regions 1208 to provide an electricalconnection to the adjacent vertical drain contact regions 1206. In theinstant example, the vertical drain extended MOS transistor 1210 is freeof a surrounding instance of the deep trench structures 1204. Electricalconnection to the vertical drain contact regions 1206 are made at a topsurface of the substrate 1202. Configuring the vertical drain extendedMOS transistor 1210 to be free of a surrounding instance of the deeptrench structures 1204 may advantageously reduce an area required forthe vertical drain extended MOS transistor 1210 compared to theconfiguration as depicted in FIG. 11, thereby reducing a fabricationcost of the semiconductor device 1200.

While various embodiments of the present invention have been describedabove, it should be understood that they have been presented by way ofexample only and not limitation. Numerous changes to the disclosedembodiments can be made in accordance with the disclosure herein withoutdeparting from the spirit or scope of the invention. Thus, the breadthand scope of the present invention should not be limited by any of theabove described embodiments. Rather, the scope of the invention shouldbe defined in accordance with the following claims and theirequivalents.

What is claimed is:
 1. A semiconductor device, comprising: a substratecomprising a semiconductor having a first conductivity type; and avertical drain extended metal oxide semiconductor (MOS) transistor,including: a plurality of deep trench structures disposed in saidsubstrate, at least one micron deep, having a dielectric liner abuttingsaid substrate; a vertically oriented drift region having a secondconductivity type opposite from said first conductivity type, disposedin said substrate, abutting and being bounded on at least two oppositesides by said deep trench structures; at least one trench gate on a gatedielectric layer disposed in a gate trench in said substrate over saidvertically oriented drift region between two adjacent deep trenchstructures of said plurality of deep trench structures; and a bodyregion having said first conductivity type disposed over said verticallyoriented drift region and contacting said gate dielectric layer.
 2. Thesemiconductor device of claim 1, in which said trench gate extendsacross said vertically oriented drift region and abuts said deep trenchstructures.
 3. The semiconductor device of claim 1, in which said trenchgate is laterally separated from said deep trench structures by aportion of said vertically oriented drift region.
 4. A semiconductordevice, comprising: a substrate comprising a semiconductor having afirst conductivity type; and a vertical drain extended metal oxidesemiconductor (MOS) transistor, including: a plurality of deep trenchstructures disposed in said substrate, at least one micron deep, havinga dielectric liner abutting said substrate; a vertically oriented driftregion having a second conductivity type opposite from said firstconductivity type, disposed in said substrate, abutting and beingbounded on at least two opposite sides by said deep trench structures;at least one trench gate on a gate dielectric layer disposed in a gatetrench in said substrate over said vertically oriented drift region; anda body region having said first conductivity type disposed over saidvertically oriented drift region and contacting said gate dielectriclayer, in which said vertical drain extended MOS transistor furtherincludes a buried layer having said second conductivity type disposed insaid substrate, extending under said vertically oriented drift region.5. The semiconductor device of claim 4, in which a drain contact metallayer is disposed on a bottom surface of said substrate.
 6. Thesemiconductor device of claim 1, in which said vertical drain extendedMOS transistor further includes at least one vertical drain contactregion having said second conductivity type disposed in said substrate,said vertical drain contact region abutting and being bounded on atleast two opposite sides by said deep trench structures, said verticaldrain contact region extending below a bottom of said deep trenchstructure.
 7. The semiconductor device of claim 1, in which a topsurface of said trench gate is substantially even with a top surface ofsaid substrate.
 8. The semiconductor device of claim 1, in which saidtrench gate extends above a top surface of said substrate, but does notoverlap said top surface of said substrate.
 9. The semiconductor deviceof claim 1, in which said trench gate and said gate dielectric layeroverlap a top surface of said substrate by at least 200 nanometers. 10.The semiconductor device of claim 1, in which said first conductivitytype is p-type and said second conductivity type is n-type.